D3CI

Electronic Components & Sub-systems

D3CI offers analog and digital Electronic Components & Sub-systems:

       - Memory modules:

              Static RAM

              Dynamic RAM (SDRAM, DDR/DDR2, DP)

              NAND FLASH

              E²PROM

              Magnetoresistive RAM

              Phase Change RAM

- Computer Modules based on DSP, PowerPC, LEON, FPGA µprocessor IPs

- Low Power DC-DC converters

- ADC/DAC

- Custom micro-electronic packaging:

      Hi-Rel packaging techniques for embedded systems applications

      Selected components and materials suitable for avionic and space

      Variations of packaged components or bare semiconductor configurations

      for optimized form factor solutions:

                       - Single or Multi-cavity Hybrid / Hermetic Ceramic

                       - System-in Package / SiP stacking - Plastic & Hermetic

High Reliability Electronic Solutions

D3CI provide Design, Manufacturing & Testing of Electronic Components & Sub-systems for Industrial, Medical, Avionic and Space.

- Manufacturing access: Access to Proven technologies & products

- Test Engineering & Test Services:

Compliance with international standards - ISO, NASA and ESCC standards

Electrical/Parametrical characterization - Analog & Digital Components & Sub-systems

Environmental testing

Radiation Tolerance Tests : SEE characterization & TID verification test

Thermal Analysis

Life Testing

Experienced personnel and partners from high-tech international industry allow to develop and supply Custom solutions implemented in accordance with international standards and/or custom specific requirements.